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orth mentioning is that Intel is the post-production technology supporter of the gate, while the other camp, IBM Zeyi gate semiconductor priority (gate-first) for the orientation. TSMC vice president of Sun Yuancheng R & D that way with the development of post-gate high-performance 28 nanometer process, the transistor characteristics, advantages and IC AD9225ARS and applications for manufacturing and other aspects, the preferred method better than the gate. Gate being taken as the main priority for IBM, including strategic partners, Global Foundries and the concessionaire have been introduced 28-nanometer manufacturing process, in which, Global Foundries in 2010 with the customer to complete the design, production in 2011, when TSMC process with almost no phase top to bottom.

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urrent low-power 28 nm TSMC process extends from the nitrogen oxide by (SiON) process, cost and AD9225ARS Suppliers and low power consumption, the main lock the mobile phone, compact and easy portable machine network (smart netbook), wireless communications, consumer electronics and other low-power portable applications market; in high-performance process, and the use of post-gate (gate-last) technology, locking the central processor, graphics processors, chipsets, and can be programmed of gate array (FPGA), game console, high-performance chip applications.

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SMC said, have included low-power 28 nm process with high dielectric / metal gate (HKMG) process technology roadmap, is expected in Q3 2010, trial production, as 28-nanometer low-power process (28LP), high-performance process (28HP) were on the end of 2010 Q1, Q2 bottom into trial production. TSMC said that since September 2008 was published on 28 nanometer technology, process development and AD9225ARS Price and volume production are expected when the project schedule.

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