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Ic AD9235BRUZ-20

500 ST-megapixel image sensor die and IC AD9235BRUZ-20 and the blueprint will also provide a standard silicon vias (TSV) package. Standard package will support the integration of chip-board (COB) sensors and discrete optical components of the camera. TSV wafer-level cameras can be realized (WLC) and other emerging technologies. To fully automated wafer-level camera assembly features, WLC can save the next generation of camera phones and digital imaging products, manufacturing costs, but also can improve picture quality.

AD9235BRUZ-20 Suppliers

ON Semiconductor low-voltage power management products, said Marie-Therese Capron, director: "NCP5680 combines the thin prism super capacitors, ultra-thin camera phones and AD9235BRUZ-20 Suppliers and digital cameras LED flash and an excellent power management. This comprehensive program LED flash brightness comparable to xenon flash, but the height of only half of the latter, and no additional LED to shoot video. NCP5680 so that more consumption of lithium-ion battery power function longer work, this new super-capacitor-based power management solutions allow smart phones to provide more functionality ."

AD9235BRUZ-20 Price

And more entered the mobile phone market, manufacturers will be seen as a breakthrough in smart phones, such as Lenovo Mobile in 2003, "May Day" during the implementation of the "island of the more tactical": over the ordinary competitive market color field, directly attacking the smart phone development effort. May PC Phone ET180 listing of all professional websites in the Forbes in the first place for nearly two months, and AD9235BRUZ-20 Price and in August listed on the G900 is the first successful one stroke to become known as "mobile phone market leader," said the China-made new mobile services phone.

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