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Previously, ST released in February 2009 EDoF 300 million pixel sensor. "The new quarter-inch 500-million pixel sensor is to create a complete sensor competitive EDoF an important part of the blueprint," STMicroelectronics Sensors Business Unit Director ArnaudLaflaquiere "Using our most advanced 65/45nm pixel technology , combined with STMicroelectronics unique quality to strengthen skills, and IC ADC0844BCJ and compatible with wafer-level packaging technology camera assembly, STMicroelectronics offers both innovative and attractive solutions, and system cost competitive. "# # # # # ST's new sensor products for product designers greater design flexibility, provide more optional features and functions, including RawBayer or System on Chip (SoC) sensor, support the expansion of depth of field (EdoF) or on-chip autofocus camera drive, high-speed industry-standard data interface, support the camera assembly of conventional packaging technology and the latest ultra-small wafer-level camera.

ADC0844BCJ Suppliers

to 250mm / sec print speed to achieve the high gray scale print quality 48 (gray scale for traditional products, 4 times). Because it can also include high-precision printed graphics, text and ADC0844BCJ Suppliers and contents of QR codes printed product, it may create new needs, such as printed recipes on the list receivable food, clothing style clothing collection bar

ADC0844BCJ Price

On the process technology, Micron and ADC0844BCJ Price and Elpida are absent in the 2009 war 50 nm, mainly due to insufficient funds, no extra money to introduce new machinery and equipment, but the two camps do not swallow it down the tone, of course, with the the DRAM industry, economic recovery, Micron and Elpida morale will be re-2010, ahead of 50 nanometer and 40 nanometer process.

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