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network, server and IC AT89S52-24PU and storage applications such as increasing demands for speed, maximum speed reached 12Gbps or even higher, prompting the connector manufacturers commercial efforts to develop high-speed and high-density connectors platform. Along with this trend, the connector impedance, crosstalk and insertion loss and other aspects of performance is also improving. Amphenol (Amphenol), ERNI, FCI, Molex, Samtec, Stewart Connector, Tyco Electronics (Tyco) and Yamaichi and other connector manufacturers have introduced new products to meet from 3 ~ 25Gbps high-speed applications.

AT89S52-24PU Suppliers

Electronics General Manager Liu Huanlin with it, said Yan, LED will be the same ceramic substrate Welcomes the major future growth of electronic kinetic energy. The companys products for the DPC ceramic substrates. At this stage of the more common type of ceramic substrate, a total heat HTCC, LTCC, DBC, DPC four, which, DPC (Direct Plate Copper) ceramic substrate is coated by vacuum sputtering copper layer, and AT89S52-24PU Suppliers and then use imaging technology manufacturing line, the process combination of materials and thin film technology, is the most widely used in recent years, thermal ceramic substrate.

AT89S52-24PU Price

COHS cooling technology is the use of copper substrate, the current attention of the other popular thermal technology is the use of ceramic substrates, ceramic substrates by a very competitive cost, and AT89S52-24PU Price and has the semiconductor close to the thermal expansion coefficient and high heat resistance, heat can effectively solve the problem of skew and high temperature process, therefore. Many companies have invested at this stage ceramic substrate technology research and development, such as Tong Hsing Electronics.

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