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ST Longgang plant after the completion of the factory area of 40,000 square meters, employed a total of 5,000. The first phase of 20,000 square meters manufacturing plant is expected to be completed by the end of September 2008, plans to end 4th quarter of 2008 to complete installation of manufacturing equipment. Expected in the first year of operation, assembly and IC BQ29311PW and test facility in Longgang production to more than 800 million chips. Gradually increase production capacity and achieve the full post-partum, with an annual capacity can be high to more than one billion chips, the equivalent of the process after ST existing capacity by 20%. Longgang Our main business is the assembly, test STs power conversion devices.

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STMicroelectronics STMicroelectronics is located in Longgang District, IC packaging and BQ29311PW Suppliers and testing of the site on November 5 new factory foundation stone laying ceremony was held, Shenzhen Mayor Xu, Executive Vice Mayor Liu Yingli invited to participate in the ceremony. The total investment of 5 billion U.S. dollars, following the Italian law in 1994 to establish a joint venture with Shenzhen SEG Group, Chinas first IC packaging and testing factory in Shenzhen STS Microelectronics Co., Ltd. has a large-scale integrated circuit after the factory.

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in the components industry, it is necessary to chip, miniaturization, integration, high performance, sound as the goal, the key breakthrough technology, the adjustment of product structure, promoting the development of the chain interaction, cultivated advantage enterprises, promote industrial upgrading. The focus on computers, network communications, digital home appliances, automotive electronics, environmental protection and BQ29311PW Price and energy saving products as well as the needs of the transformation of traditional industries, the development of chip-related electronic components, printed circuit board, sensitive components and sensors, hybrid integrated circuits, new mechanical and electrical group pieces, green battery, new power electronic devices, optical communication, high-brightness light-emitting diodes.

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