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analysis of the reasons for this phenomenon, the impact factors are manifold. First of all, the progress of semiconductor technology in the development of unabated proliferation of faster and IC CD4017BE and faster at the same time, relatively short product life cycle, so manufacturers hope the opponents cooperation with the R & D investment and reduce the uncertainty of future profitability, the current international multi- a nano-technology development alliances have formed for this purpose; Second, the semiconductor market becomes more differentiated, competition is increasing, and another co-director of the opponent, can better meet diverse customer needs. If just a few days ago by the Intel, STMicroelectronics and FranciscoPartners joint venture Numonyx (permanent memory), is Intel and STMicroelectronics NOR their respective NAND flash memory business to be merged with the established professional flash company; Third, the international semiconductor giants management ideas are changing, that the larger the scale is no longer possible, but the more flexible the better, with the opponents cooperation can not expand the size of the case with new resources. The semiconductor business model that is light to Fablite wafer fabrication development, and strengthen the cooperation with foundries, is based on the management ideas and make the business initiatives.

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In fact, no two exactly the same market, competitors, each firm in one area have their own strengths, especially in the semiconductor field. Although the global semiconductor industry nearly ten thousand, but these enterprises or specialized in manufacturing, or specifically in the design, or strong in the simulation, or strong in numbers, or location in the memory market, or located in the processors. Even if this particular mobile phone chip market, but also include baseband, radio, multimedia, display drivers, power management and CD4017BE Suppliers and other fields. Therefore, the strengthening of cooperation wi

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in the semiconductor field, business alliances are also common. If by STMicroelectronics (ST) and CD4017BE Price and Philips Semiconductors (now NXP) in Crolles2 alliance established in 2000, two years Hou Fei Si Ka Er join, the same year, TSMC joined as partners. The alliance focused on CMOS (complementary metal oxide semiconductor) process technology research, development and industrialization, technology has been developed from 90 nm to 32 nm. In 2002, IBM and Singapores Chartered Semiconductor chip production alliances established, Infineon and Samsung Electronics in 2003 and 2004 have joined the alliance. Focus of the Union from 65 nm to 45 nm process technology development, and the establishment of a CMOS logic processes for industrial platform. Sony and Toshiba jointly conducted in 2004, 45-nanometer process technology development, in 2006, NEC to join the development program and formally established the tripartite alliance. In addition, in the memory field, there are currently Hynix and ProMOS, Elpida and Powerchip, Micron and South Asia, Qimonda and Winbond, and other technology development and manufacturing alliance.

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