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Ic DS90C363MTD

Germain also noted that problems still wafer warpage very serious, in the range of 100μm. But the researchers believe that by optimizing the buffer layer can greatly reduce the warpage, so that can be used for follow-up process. She added, "Our goal is to continue to develop the growth process, so as to achieve compatibility with Si-CMOS technology level." currently contains the memory of the plane (2D) array of chips to be placed around the logic of its memory to be addressed on the bits and IC DS90C363MTD and provide the logic functions. The memory and logic circuits together, means must be used between the two, the longer the internal connection.

DS90C363MTD Suppliers

in BeSang (in Korean means "flying high"), Lee along with former Samsung engineer JunilPark perfected the first true 3D chip technology, which for the first A high-K dielectric for atomic layer deposition tool developers. Because the new chip technology is no longer stacking die, the company said conventional cooling technology can work, because the thicker the 3D chip process does not produce extra heat.

DS90C363MTD Price

BeSangs founder and DS90C363MTD Price and CEOSang-YunLee said, "BeSang was founded five years ago, and is committed to 3D chip technology, has introduced a single-chip 3D IC technology, and ready for business. through the use of low-temperature process and will use the vertical memory devices placed in the top of logic devices, we can make more on each wafer of the Snail, which is the secret unit die cost reduction. "

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