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HD74LS04P datasheet pdf datenblatt

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Ic HD74LS04P

The VEMI45AB-HNH, VEMI65AB-HCI, and IC HD74LS04P and VEMI85AB-HGK devices for data lines provided in line with IEC 61000-4-2 (ESD) and IEC 61000-4 -5 (lighting) specification ± 25kV and ± 18 kV (air and contact discharge) and 4 A (tp = 8/20μs) transient protection. VEMI45AC-HNH, VEMI65AC-HCI, and VEMI85AC-HGK devices for data lines provided in line with IEC 61000-4-2 (ESD) and IEC 61000-4-5 (lighting) specification ± 12kV and ± 10 kV (air and contact point of discharge) and 2 A (tp = 8/20μs) transient protection. All six devices are in line with RoHS 2002/95/EC and WEEE 2002/96/EC.

HD74LS04P Suppliers

LTM9001 with 11.25mm x 11.25mm LGA package, using a multi-layer substrate, it can be to sensitive analog circuits and HD74LS04P Suppliers and digital traces to isolate. LGA package placed in the bottom of the pad to the clock signal and digital input and output separated, which simplifies the design of the layout work. Bypass capacitor placed inside the module and close to the chip. LTM9001 requires no external capacitors, the space is about half of discrete components to implement the program.

HD74LS04P Price

RF applications in a large dynamic range of signal sampling on a wealth of experience needed to maximize the ADCs full functionality. Need to master information about the amplifier output stage and HD74LS04P Price and ADC front-end to match the impedance of knowledge, but require careful attention to layout to minimize the digital output to the sensitive analog input coupling. In many cases, ADC performance degradation is often because the layout is not good. These factors are likely to specialize in the field of RF engineers or digital challenge. LTM9001 the component selection, input impedance matching, filter design and layout of the burden transferred to the device from the place where designers.

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