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IRF7341 datasheet pdf datenblatt

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Ic IRF7341

2009 Q2 gross margin was 26.1%, and IC IRF7341 and Q1 2009 gross margin of 26.3% was essentially flat. As expected, because the spending of unused capacity, low efficiency of manufacturing operations activities and some areas, especially in Chinas market demand for the product

IRF7341 Suppliers

To meet the growing need for higher I / O Bandwidth demand, Virtex-5 FXT platform integrates high-performance, low-power RocketIO GTX transceivers that can support 500 Mbps to 6.5Gbps data transfer rate. Customers can design supports XAUI, Fibre Channel, SONET, Serial RapidIO, PCI Express 1.1 and IRF7341 Suppliers and 2.0, Interlaken and other standard applications. 6.5Gbps GTX transceivers rate of less than 200mW per channel at typical power consumption, but also incorporates many advanced features, such as linear equalization and transmit pre-emphasis to compensate, but also integrates a four-tap DFE receiver equalization can improve more When the high line rate signal integrity. The new transceiver blocks also include a unique multi-code physical coding sublayer to support 64B/66B and 64B/67B encoding / decoding scheme, each channel can save thousands of logic cells. In addition, cross-platform pin compatibility enables customers for the Virtex-5 LXT and SXT devices designs to Virtex-5 FXT devices, which can take full advantage of its higher performance embedded processing and serial connectivity. (a) ST-Ericsson entered into the sales of Harmony STMicroelectronics sales accounts are included in both the telecommunications and distributors.

IRF7341 Price

FXMA2102 I2C bus to achieve maximum load capacitance, providing lower power consumption than similar devices, and IRF7341 Price and the transcendent 8kV HBM ESD protection. The device uses 8-pin lead-free MicroPakTM package (1.6mm x 1.6mm) or ultra-thin MLP (Ultrathin MLP, 1.2mm x 1.4mm) package for smart phones, mobile phones, the Internet, mobile Internet devices, portable medical equipment and applications such as set-top box design. low-power chip, which fully supports perpendicular recording technology with the latest interface standards, to achieve ultra-compact design of the drive, and this design can provide extremely low cost three times the capacity of flash memory.

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