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BMC AG, said China, 2008 China International Electronic Packaging and IC LT1172CS and Assembly Technology Exhibition and Conference facilities, supported by the German Engineering Federation (VDMA) active support. Meanwhile, major domestic packaging equipment, packaging factory, SMT equipment manufacturers, electronics manufacturers Dengjun expressed strong desire to participate. China is a global electronics manufacturing center in the near future it will also become a center of the global packaging industry. Therefore, to solve the back-end components in the packaging and integration of front-end assembly, the Chinese than any one country or region is urgent.

LT1172CS Suppliers

2007 for the first time will combine packaging and LT1172CS Suppliers and electronic assembly to communicate with "CHINA SMT FORUM" aroused the concern of the industry. It is reported that US-Saudi International Exhibition by the German company (BMC AG) sponsored the annual General Assembly this year will add exhibition, PACKAGING / SMT / ASSEMBLY exhibition will highlight advanced electronic packaging and assembly technology, through the electronic packaging technology and assembly process equipment integration of electronic packaging, assembly and professionals in related fields to build a relevant parties on the words of each other on the technology platform.

LT1172CS Price

In order to meet the front of the back-end packaging and LT1172CS Price and assembly of components of the convergence trend, packaging industry and its suppliers and SMT equipment manufacturers and equipment manufacturers only between closely can really meet the consumer demand for the electronic age. Determined by the process equipment and configuration, this is the future development of Chinas electronics industry trends. Chinas semiconductor packaging is in a stage of rapid development, the expansion of electronics assembly industry has been slowing trend. In this context, enhanced packaging and assembly industry, technology exchange and collaboration between, will promote Chinas semiconductor packaging, electronics assembly industry continued to play an active role in rapid development. Regrettably, the current domestic packaging and electronic assembly will be a communication platform for the organic convergence is less.

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