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In addition to other projects in Sichuan Polysilicon, Tianwei change today also issued a series of foreign investment announcement, involving amorphous silicon solar cell production lines, wind power blades.

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According to company information fixed Ying, Ying Electronics plans to set the PC to its traditional production moved to the mainland, and M62449FP Suppliers and its factories in Taiwan and then to focus on high-density interconnect (HDI) board production. Given the high density interconnect board Ying production technology from South Korean DAP, the company be part of Taoyuan County Kameyama plant production capacity in the July 2007 transfer of high density interconnect board production. The company plans its initial monthly capacity of high-density interconnect board from 100,000 to 150,000 square feet, and then gradually increase to 30 million square feet. Initial production will focus on the mobile phone board, later to increase applications, such as: desktop computers (PC), laptop computers and other handheld devices. Monthly capacity of 500,000 square feet of the Turtle will be transferred to conventional PCB production in Kunshan, Jiangsu Province (China) factory. Kunshan plant is currently focused on the motherboard and notebook PCB. All for, such as liquid crystal display (LCD) panels, automotive electronics, wireless local area network (LAN) cards and high-end server applications such as PCB production remains in Taiwan.

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oldman Sachs expects the photovoltaic market next year, only slightly, originally expected to be 85,000 kilowatts of solar generating capacity, now estimated value adjustment to 7.5 million kilowatts. Other analysts for next year is optimistic about the market.

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