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A: In the past few years, the semiconductor industry R & D in the field of 450mm process has begun to perk up. According to our road map, 450mm wafer processing in 2014 between the 2016 launch. Wafer size Although the increase might not reduce the overall cost of the industry (TCO), but certainly help to reduce chip production costs. Also, if the productivity of 450mm wafer production line can be improved, then the 300mm wafer production line will also benefit . because the 450mm wafer production line is also used new technology in 300mm wafer production line can be applied .

XCR3384XL-7FT256C Suppliers

D flash memory card required nominal level is 2.9V. When the VIN and XCR3384XL-7FT256C Suppliers and VOUT is 3.6V compared to 2.9V, FAN5362 is able to provide 94% of peak efficiency, At the same time in the light load (1mA) conditions to maintain more than 86% efficiency. FAN5362 is designed for low headroom operation designed to provide high efficiency and optimization of control functions, eliminating the existing shortcomings of high-power LDO, but also to avoid General buck converter with low margins can not be good working condition to respond to the problem.

XCR3384XL-7FT256C Price

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